Building Envelope 2 BSCI 9220

In the Building Envelope 1 course, the design and performance of above grade envelope assemblies were covered. In the Building Envelope 2 course, below grade assemblies including basements, crawlspaces, parkades, podium waterproofing, foundation walls, and slabs on grade and slabs below grade, will be addressed. The course will pivot to more advanced application of the theoretical and practical aspects of building envelope design. This will include design review of proprietary building envelope assemblies, establishing effective thermal performance of complex buildings and building envelope condition assessments and forensics. Case studies will be used to develop the student's abilities to make and communicate engineering judgements. Topics include: Below grade assemblies including walls, floor, and roof assemblies separating both heated and unheated spaces from the ground. Design and performance aspects with respect to the control of surface water, ground water, heat loss, vapour diffusion, air leakage, condensation, as well as improving long term durability of the assemblies. Overview of Building Codes applied to below-grade assemblies 2D and 3D building envelope details of below grade assemblies. Assessing performance and risks of "proprietary" panelized envelope systems such as curtain wall, window wall, mass timber panels and precast concrete. This will include assessment of 2D and 3D building envelope details with the specific focus on the "continuity" of the building envelope control layers (rain penetration control, thermal insulation, air barrier, and vapour retarder/barrier). Design of high thermal performance envelopes including use of BC Hydro's Thermal Bridging Guide and other tools to assess and reduce the impact of thermal bridging in buildings. Building envelope condition assessment methods, common failure modes, and remedial strategies using case studies Innovations and research pertaining to building envelope assemblies and components with the focus on moisture, air, heat management, and durability.